A prerequisite for the performance of conductive devices is the lack of moisture inside the insulation. The most reliable method of sealing is to pour the front part with glass. In the present work, the effect of the embedment depth on the strength of the sealing of a conductive rod was investigated. It is shown that a change in the geometry of a junction does not affect its strength, and the plastic nature of fracture is shown. A control experiment was conducted on a real product.
cable, conductive rod, solder glass, bond strength, bead junction, humidity, sealing, fill, load capacity
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