Russian Federation
Russian Federation
Russian Federation
UDK 691 Строительные материалы и изделия
It is shown that numerous devices contain their own electrical power sources that use a significant number of bipolar transistors and thyristors of medium and high power, which require additional cooling in the form of external radiators to remove excess heat. For their manufacture, in addition to traditional alloys based on aluminum, materials such as polymers with fillers of high thermal conductivity are promising. A composite surface saturation technology is proposed that uses boron nitride nanocrystals to reduce thermal resistance at the interface. It has been established that the heat-conducting properties both along and across the polymer fibers, as the content of the nanocrystalline form of boron nitride increases to 25 %, they increase and reach a value of 21,3 W/(m K). This value is more than twice the possible maximum thermal conductivity coefficient in the absence of a graphene layer: 9,8 W/(m K) with a boron nitride mass content of up to 50 %. Due to its characteristics, polymer/graphene composite material has promise as a material for cooling devices with high energy density.
robotic fire extinguishing installation, processor cooling, composite material, boron nitride, graphene oxide
1. SP 160.1325800.2014. Multifunctional buildings and complexes. Design rules. M.: Ministry of Construction, 2014. 21 p.
2. Gorban Yu.I. Fire robots and gun equipment in fire automatics and fire protection. M.: Pozhnauka, 2013. 351 p.
3. Emerging flexible thermally conductive films: mechanism, fabrication, application / C.P. Feng [et al.] // Nano-Micro Lett. 2022. № 14. P. 127.
4. High thermal conductivity of high-quality monolayer boron nitride and its thermal expansion / Q. Cai [et al.] // Sci. Adv. 2019.
5. Highly thermally conductiveyet electrically insulating polymer/boron nitride nanosheets nanocomposite films for improved thermal management capability / J. Chen [et al.] // ACS Nano 2019. № 13 (1). P. 337–345.
6. Highly thermoconductive, thermostable, and super-flexible film by engineering 1D rigid rod-like aramid nanofiber/2D boron nitridenanosheets / K. Wu [et al.] // Adv. Mater. 2020. № 32 (8).
7. Effects of chemical bonding on heat transport acrossinter faces / M.D. Losego [et al.] // Nat. Mater. 2012. № 11. P. 502–506.
8. Control of a dual-cross-linked boron nitride framework and the optimized design of the thermal conductive network for its thermoresponsive polymeric composites / F. Jiang [et al.] // Chem. Mater. 2019. № 31. P. 7686–7695.
9. Challenges and solutions in surface engineering and assembly of boron nitride nanosheets / Z. Liu [et al.] // Mater. Today. 2021. № 44. P. 194–210.
10. Construction of 3D skeleton for polymer composites achieving a high thermal conductivity / Y. Yao [et al.] // Small. 2018. № 14 (13). e1704044.
11. Plimpton S. Fast parallel algorithms for short-range molecular-dynamics // J. Comput. Phys. 1995. № 117. P. 1–19.
12. An ab-initio CFF93 all-atom force-field for polycarbonates / H. Sun [et al.] // J. Am. Chem. Soc. 1994. № 116 (7). P. 2978–2987.
13. Exfoliated hexagonal boron nitride-based polymer nanocomposite with enhanced thermal conductivity for electronic encapsulation / Z. Lin [et al.] // Compos. Sci. Technol. 2014. № 90. P. 123–128.
14. Directional xylitol crystal propagation in oriented micro-channels of boron nitride aerogel for isotropic heat conduction / M.A. Kashfipour [et al.] // Compos. Sci. Technol. 2019. № 182.
15. Highly thermally conductive graphene-based thermal interface materials with a bilayer structure for central processing unit cooling / Z.G. Wang [et al.] // ACS Appl. Mater. Interfaces. 2021. № 13 (21). P. 25325–25333.
16. Qian X., Zhou J., Chen G. Phonon-engineered extreme thermal conductivity materials // Nat. Mater. 2021. № 20. P. 1188–1202.